The global Ball Grid Array (BGA) packaging market is projected to grow significantly in the coming decade, with a forecasted market size of USD 1.29 billion in 2024. The market is expected to expand ...
Offered in ceramic ball grid array (BGA) packages, the CHC-Precision series resistor networks deploy all circuits on the bottom side of the component in order to eliminate wrap-around terminations.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback