Piezoresistive pressure sensors are pivotal components within the vast field of microelectromechanical systems (MEMS), integrating semiconductor physics with advanced fabrication techniques to detect ...

Infineon has introduced its XENSIV SP49 tire pressure monitoring sensor, which integrates MEMS (micro-electromechanical systems) sensors and ASIC to provide advanced tire pressure monitoring systems.

LONDON — The Fraunhofer Institute of Microelectronics Circuits and Systems (Duisburg, Germany) and Livingston, Scotland-based Point 35 Microstructures have collaborated to develop a process module for ...

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has introduced the market's first MEMS water/liquid-proof absolute ...

Fig 1. The MEMS pressure sensor detects the tensile stress on a thin silicon membrane that changes the piezo-resistance of elements on the membrane’s surface. Fig 2. The MEMS sensor’s piezo-resistive ...

The "Automotive MEMS (Micro Electromechanical System) Sensor Research Report, 2025" has been added to ResearchAndMarkets.com's offering. MEMS technology stands at the forefront of automotive ...

Are you considering using a MEMS piezoresistive pressure sensor for your application? Or would you simply like to know more about piezoresistive technology on silicon dies? Merit Sensor designs and ...

SHANGHAI--(BUSINESS WIRE)--During the Shanghai Auto Show, RoboSense (https://robosense.ai/), a smart and automotive LiDAR system provider, and Webasto (https://www ...

A research team led by Profs. Chen Deyong and Wang Junbo from the Aerospace Information Research Institute (AIR) of the Chinese Academy of Sciences has developed a novel microsensor that enhances both ...

Semiconductor engineers leveraged manufacturing techniques developed for computer chips to create microscopic MEMS devices. Fabrication methods for MEMS sensors, such as layer deposition, ...

Wearable devices are a hotbed of sensors as well as a design conundrum due to size, power, and integration challenges. At the same time, however, major advancements in sensor and ...